Adhesive innovations for sustainable packaging
05 January 2024
HENKEL ADHESIVE TECHNOLOGIES will present two solutions at LogiMAT 2024: automated packaging and palletising with hot melt adhesives.
The Technomelt E-COM portfolio for e-commerce packaging offers hot melt adhesive solutions for right-sized cartons and envelopes.
The firm also offers a solution for palletising: instead of large quantities of plastic film, hot melt adhesives from the Technomelt Supra PS product range stabilize stacked goods during transport on pallets. LogiMAT takes places in Stuttgart from March 19-21, 2024. Stand 4A53
For more information, visit www.henkel.com